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Chip R&D Department
Solution R&D Department
Chip Operation Department

IC System Engineer

IC design class / Monthly salary 20K-40K
Work location: Shanghai, Nanjing

Job responsibilities:

1. Responsible for chip demand analysis, specification definition, architecture and clock reset scheme design, key IP/device selection, etc.;

2. Responsible for the optimization analysis of the system architecture, performance and indicators, organize the positioning and solve the key problems in the system;

3. Responsible for the coding implementation and simulation debugging of core modules;

4. Responsible for competitive product analysis, forward-looking technical research, and provide basis for decision-making and planning.


Job requirements:

1. Computer/electronics/communication related majors, with five years of bachelor degree or more than three years of relevant work experience after master degree;

2. Have a solid chip design foundation, familiar with the whole process of chip design, and have experience in successful tapeout and mass production;

3. Proficient in computer architecture and network communication principles, familiar with common bus protocols, data communication and interface protocols;

4. Familiar with the chip SOC architecture, with WiFi or switching/routing chip related design and debugging experience;

5. Have strong learning and innovation ability, good organization, communication, expression skills and teamwork spirit;

6. Have certain team management experience, able to lead the team to complete product development or technical research.

Digital IC Development Engineer

IC design class / Monthly salary 20K-40K
Work location: Shanghai, Nanjing

Job responsibilities:

1. Complete the module design, RTL coding, simulation and debugging of digital circuits;

2. Complete SOC system and IP integration, participate in the whole process of chip development, and complete design documents/reports at various stages;

3. Responsible for the prototype verification of chip functions on FPGA;

4. Participate in the synthesis and timing closure of the chip.


Job requirements:

1. Three years of bachelor's degree or more than one year of master's related work experience;

2. Have strong logical thinking, debugging and analysis skills, good communication and coordination skills and teamwork spirit;

3. Have a good foundation of digital circuit design, be proficient in Verilog, and be familiar with related development and debugging tool software;

4. Familiar with FPGA structure and development tools, and master the related design process;

5. Understand computer architecture and network communication principles, master common data communication and interface protocols;

6. Experience in designing and debugging WiFi baseband/MAC/switching system/router products is preferred.

Digital IC Verification Engineer

IC design class / Monthly salary 20K-40K
Work location: Shanghai, Nanjing

Job responsibilities:

1. Write a verification plan, develop a verification plan, build a verification environment, and write verification use cases;

2. Complete the simulation verification and debugging before and after the module level and system level of the chip, collect and improve the coverage rate, and complete various documents/reports;

3. Cooperate with chip design engineers to find design defects, locate and solve various problems in chip design;

4. Co-design and software engineers conduct FPGA verification and debugging.


Job requirements:

1. Three years of bachelor's degree or more than one year of master's related work experience;

2. Have meticulous observation and analysis skills and certain logical thinking skills, good communication and coordination skills and teamwork spirit;

3. Familiar with verification language, understand UVM verification methodology, have strong script programming ability, and be familiar with related tools and software;

4. Understand computer architecture and network communication principles, and be familiar with commonly used data communication and interface protocols.

IC Backend Engineer

IC design class / Monthly salary 15K-40K
Work location: Shanghai, Nanjing

Job responsibilities:

1. Responsible for the automatic placement and routing of block/top level chips, and complete the physical design and implementation from netlist to GDS;

2. Cooperate with front-end design engineers to complete the overall chip layout planning and chip clock tree design;

3. Responsible for timing analysis and optimization, and complete chip timing signoff;

4. Responsible for physical verification of chip layout, including DRC, LVS, ANT, ESD and Latch up etc;

5. Responsible for chip power consumption and IR drop analysis and optimization;


Job requirements:

1. Bachelor degree or above in microelectronics/electronics/communication related majors, with more than one year of back-end work experience;

2. Familiar with the back-end design process (PR/PV/PA/STA, etc.), proficient in using relevant EDA tools (INNOVUS/PT/Calibre/Redhawk, etc.), able to independently complete the top-level or module-level back-end implementation;

3. Possess strong scripting language (Perl/Tcl/Shell) programming ability and good professional English reading ability;

4. Have strong learning and stress resistance, good teamwork and communication skills;

5. Experience in large-scale chip Tapeout, or experience in mixed signal layout is preferred.

Digital Algorithm IC Design Engineer

IC design class / Monthly salary 15K-40K
Work location: Shanghai

Job responsibilities:

1. Responsible for the design of related circuits of CMOS wireless transceiver chip;

2. Responsible for the verification of CMOS wireless transceiver chip;

3. Responsible for the integration of the digital part of the CMOS wireless transceiver chip;

4. Responsible for the completion and review of design documents and reports for each stage of work.


Job requirements:

1. Three years of bachelor's degree or more than one year of master's related work experience;

2. Have strong logical thinking, debugging and analysis skills, good communication and coordination skills and teamwork spirit;

3. Have any digital module design experience related to CMOS wireless transceiver digital processing: including but not limited to various digital processing algorithms/calibration algorithms/channel filtering, etc.;

4. Experience in wifi design is preferred.

RF Analog IC Design Engineer

20K-45K
Shanghai

Job summary:
Responsible for designing CMOS wireless communication chip analog radio frequency integrated circuit


Job responsibilities:

1. Responsible for circuit design related to CMOS wireless communication chip (including DC-DC/digital-analog hybrid circuit design)/layout implementation/chip testing;

2. According to the company's product planning, conduct forward-looking circuit structure/layout layout research, and draft patents with patent layout.


Job requirements:

1. Master's degree or above, major in microelectronics or integrated circuit design, circuit design experience is required;

2. Proficiency in the use of tool software and test instruments required for the design of analog radio frequency circuits;

3. Possess strong learning ability, logical thinking and innovative consciousness;

System R&D Engineer

12K-35K
Shanghai, Shenzhen

Job Responsibilities:

1. Compilation and maintenance of Linux module driver code;

2. Assist chip designers in simulation/FPGA verification;

3. Realize and test router function modules, middle layer components, and user interfaces;

4. Complete the writing and output of standardized documents.


Job Requirements:

1. Bachelor degree or above, computer, software engineering, communications, electronics and other related majors, there is no limit to the major of those who are excellent in interviews;

2. Full of passion, proactive, responsible person is preferred.

Senior System R&D Engineer

20K-45K
Shanghai, Shenzhen

Job responsibilities (including requirements for system R&D engineers):

1. Have the ability to tackle problems and overcome difficulties independently, and quickly sort out and solve key problems;

2. Carry out module design and output code is easy to maintain, testable, and conform to the Linux kernel style;

3. Able to guide newcomers and help grow.


Job requirements (including requirements for system R&D engineers):

1. More than 2 years of development work experience, working in the direction of linux/android system development is preferred;

2. Familiar with development tools under the linux development environment, such as Vim, Git, etc.;

3. Have good communication skills and be able to complement each other in the team;

4. Those who have experience in Linux kernel, android framework, network system, chip design, etc. are preferred.

System R&D Supervisor

25K-50K
Shanghai, Shenzhen

Responsibilities (including requirements for senior system R&D engineers):

1. Have the ability to be responsible for and guide a team of less than 4 people, and coordinate various departments to complete the project;

2. Lead by example, take the pressure, and make breakthroughs in key and difficult points;

3. Complete user requirements, technology selection and evaluation, technology development and public relations, and finally test the entire link of acceptance and release.


Job requirements (including requirements for senior system R&D engineers):

1. More than 5 years of development work experience, project management experience is preferred;

2. Have their own technical expertise and be able to export technology;

3. Have a pursuit, hope to make a breakthrough, and have a strong self-driving ability.

Wireless Protocol Stack R&D Engineer

15K-35K
Shanghai, Shenzhen

Job Responsibilities:

1. Design and develop 802.11-related protocol stacks and solutions;

2. Design and develop protocol stacks and solutions related to Mesh networks and P2P networks;

3. Design and develop TDLS wireless standard related protocol stacks and solutions;

4. Use CSI applications to optimize network transmission quality from the perspective of protocol stacks;

5. Compilation of related documents for wireless protocol stack research and development;

6. The code, version and other maintenance work of the wireless communication module.


Job Requirements:

1. Bachelor degree or above in communication, computer, electronics related majors;

2. Familiar with TCP/IP/802.11/802.3 protocol stack

3. Proficient in Wi-Fi/Bluetooth/Zigbee protocols;

4. Experience in development of 80211 protocol stack, Mesh network, P2P network, TDLS wireless standard, CSI application, etc. is preferred.

Wireless driver R&D engineer

22K-45K
Shanghai, Shenzhen

Job Responsibilities:

1. Compilation and maintenance of module driver code on Linux and other systems, and docking of interfaces;

2. Use CSI applications to optimize network transmission quality from a driver perspective;

3. Compile related documents for wireless driver R&D

4. Proficient in various network test software and test equipment, and output various Wi-Fi-related professional test reports;

5. Assist FAE engineers to analyze and solve the software and hardware problems of customers in the chip application process.


Job Requirements:

1. Bachelor degree or above in communication, computer, electronics related majors

2. Familiar with TCP/IP/802.11/802.3 protocol stack;

3. Proficient in Wi-Fi/Bluetooth/Zigbee protocols;

4. Experience in linux network driver development is preferred.

Radio frequency verification test engineer

20K-40K
Shanghai, Shenzhen

Job Responsibilities:

1. Design the chip radio frequency performance test plan, conduct the radio frequency performance test of each product, and output the test report;

2. Assist FAE engineers to analyze and solve the RF related problems of customers in the chip application process;

3. For wireless testing equipment, design production line RF testing and calibration tools to help the production line successfully complete production testing;

4. Compile technical documents related to RF testing and tools to help customers quickly understand and use production line tools.


Job Requirements:

1. Bachelor degree or above in communication, computer, electronics related majors;

2. Familiar with the use of Ultra FX and Agilent's wireless test equipment;

3. Master C and C++ programming languages, familiar with scripts such as Perl/Shell/Tcl;

4. Have team spirit, learn to make progress, have the ability to solve problems independently, and have good communication and learning skills;

5. Those who have the experience of using the ultimate instrument and Agilent are preferred.

Senior Engineer of Wireless R&D

20K-40K
Shanghai, Shenzhen

Job responsibilities (including requirements for wireless R&D engineers):

1. Have the ability to tackle problems and overcome difficulties independently, and quickly sort out and solve key problems;

2. Carry out module design and the output code is easy to maintain and testable;

3. Able to guide newcomers and help grow.


Job requirements (including requirements for system R&D engineers):

1. More than 2 years of development work experience

2. Have good communication skills and be able to complement each other in the team;

3. Experience in Linux wireless driver, network system, chip design, etc. is preferred.

Head of Wireless R&D Engineer

25K-45K
Shanghai, Shenzhen

Responsibilities (including requirements for wireless senior R&D engineers):

1. Have the ability to be responsible for and guide a team of less than 4 people, and coordinate various departments to complete the project;

2. Lead by example, take the pressure, and make breakthroughs in key and difficult points;

3. Complete user requirements, technology selection and evaluation, technology development and public relations, and finally test the entire link of acceptance and release.


Job requirements (including requirements for senior system R&D engineers):

1. More than 5 years of development work experience, project management experience is preferred;

2. Have their own technical expertise and be able to export technology;

3. Have a pursuit, hope to make a breakthrough, and have a strong self-driving ability.

Senior Simulation Engineer

20K-40K
Shanghai, Shenzhen

Job Responsibilities:

1. High-speed circuit signal integrity (SI) simulation and power integrity (PI) simulation;

2. Carry out hardware high-speed circuit simulation evaluation and make suggestions for improvement;

3. Communicate information analysis such as simulation model with component suppliers, and use simulation to reproduce and provide improvement suggestions;

4. Responsible for PCB board material selection, plate making process evaluation, laminated design and engineering problem confirmation;

5. Establish a simulation model based on the data from the PCB factory's plate-making process.


Job requirements:

1. Bachelor degree or above, major in electronics, proficient in reading English materials, and proficient in signal integrity theory;

2. Have a deep understanding and mastery of signal integrity analysis and high-speed circuits;

3. Have experience in SI or PI simulation and analysis;

4. Familiar with PCB board selection, laminated design and PCB factory process production routine knowledge;

5. Ability to use signal integrity simulation tools, such as sigrity, HFSS, etc.;

6. Ability to independently perform simulation evaluation of high-speed signals such as USB3.0, DDR, PCIE on the motherboard and give suggestions for improvement;

7. More than 3 years of relevant simulation experience.

Senior hardware engineer

20K-40K
Shanghai, Shenzhen

Job Responsibilities:

1) Responsible for the review of the customer's design data;

2) Responsible for the development of new hardware projects;

3) Responsible for coordinating and solving customer's R&D and production problems.


Job requirements:

1) Bachelor degree or above in electronics and communications;

2) Familiar with the basic process of hardware research and development, proficient in SCH, PCB related development software; such as: Oracad, PowerPCB and other EDA software;

3) Master the basic principles of analog and digital circuits;

4) Have a more comprehensive and in-depth understanding of hardware device selection, and be familiar with the basic common sense and usage of various commonly used ICs and discrete components;

5) Familiar with ARM or X86 architecture, Memory, Audio, LCD, Camera, USB, Power and other circuits;

6) Proficiency in the use of Debug debugging related instruments;

7) Good teamwork spirit, good technology development learning and research ability, able to withstand work pressure;


One of the following experience is preferred:

1) Be engaged in high-speed signal processing, and have a certain theoretical basis for high-speed signals;

2) Have a certain foundation for Audio test specifications and Debug;

3) Have experience in PCB design of more than 8 layers;

4) Have experience in router industry.

RF engineer

20K-40K
Shanghai, Shenzhen

Job Responsibilities:

1. Responsible for WiFi radio frequency testing, problem diagnosis, and radio frequency performance tuning;

2. Instruct and support customers to use our chip PCBA production test WiFi test problems;

3. Solve the problems encountered by customers during the use of WiFi.


Job requirements: 

1. Full-time unified recruitment of bachelor degree or above, majors in communications, electronics, radio frequency and other related majors;

2. Familiar with wireless communication test instruments such as Agilent, Rhodes Watz, Litepoint, etc. is preferred;

3. Have an understanding of international standards in the fields of RF, EMC, etc., especially familiar with WiFi IC and have practical experience in operation;

4. Have a strong sense of work responsibility and team awareness, able to withstand certain work pressures.

Senior ATE development engineer

15K-40K
Shanghai

Job Responsibilities:

1. Responsible for chip CP/FT engineering and mass production test program development;

2. Responsible for testing hardware development (including LoadBoard/probecard/socket, etc.);

3. Familiar with products such as RF and AP chips is preferred;

4. Familiar with one of Chroma3380/J750/Ultraflex/93K machines;

5. Optimize the test plan, increase the coverage, optimize the test time, and reduce the test cost;

6. Solve mass production testing and yield problems;

7. Assist designers to complete batch chip parameter testing;

8. Teamwork, abide by process specifications, and ensure project progress and quality.


Job requirements:

1. Bachelor degree or above; electronic information engineering, microelectronics, electronic science, computer, automation and other related majors;

2. More than 3 years of IC mass production test and development experience;

3. Familiar with ATE test machine (chroma93KJ750Accotest, etc.); familiar with C and C++ software knowledge; familiar with circuit test principle;

4. Proficiency in digital-analog circuit testing technology; proficient in chip CPFT test methods; proficient in coverage analysis, mass production yield, and cost optimization;

5. Have a certain English reading ability (machine or technical English documents in daily work);

6. Have excellent dedication and responsibility; have relevant chip ATE test and development experience; be able to reasonably plan and decompose tasks according to project requirements, and achieve them;

7. Adhere to quality orientation; have good problem-solving skills, learning and research skills.

Substrate design engineer

15K-40K
Shanghai

Job Responsibilities:

1. Design QFN, QFP and BGA substrate according to the needs of the chip department;

2. Assist simulation engineers to complete the optimization of substrate;

3. Export the substrate production file and review the Gerber diagram with the substrate manufacturer;

4. Organize and backup design related documents;

5. Assist in the formulation of substrate design specifications.


Job Requirements:

1. Bachelor degree or above, major in electronics related to microelectronics, electronic information and science;

2. Two years or more of packaging design experience, familiar with semiconductor packaging process and technology;

3. Familiar with design related software such as AutoCAD CAM350 Cadence APD;

4. Have the ability to organize and coordinate, be able to withstand certain work pressures, have a good sense of customer service and teamwork and communication skills;

5. Those who have experience in large packaging factories are preferred (ASE, Amkor, Changdian, etc.);

6. Good English reading and writing skills.